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Indigo Xtreme Thermal Compound

Indigo Xtreme
High Conductivity Alloy
2011-X1 Kit
LGA2011 Compatible

Frys#: 8053574 Model: 2011-X1
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*** This 2011-X1 Kit is not compatible with Haswell-E (5820K, 5930K & 5960X) Processors ***



Indigo Xtreme™ represents a whole new approach to high-performance cooling of your CPU. Indigo Xtreme™ is a precision Engineered Thermal Interface (ETI) that keeps CPUs cooler. Much cooler.

The Indigo Xtreme innovative and patented structure deploys a highly conductive Phase Change Metal Alloy (PCMA) into all the surface micro-asperities on your CPU lid and heat sink, resulting in the lowest resistance heat path of any grease, paste, or pad thermal interface product available today.


High Thermal Performance
• Bulk thermal conductivity >20 W/mK
• Lower overall thermal resistance than any grease, paste, or pad TIM
• No cure time

High Reliability
• Fully sealed structure - no mess or migration
• Most consistent performance - applies the correct amount of alloy every time
• Gallium-free
• Laser-cut precision

User Friendly
• Fully compatible with copper and aluminum surfaces
• Peel-and-stick application
• Easy clean up - just peel to remove

Proven

As confirmed by independent tests, the Indigo family of engineered thermal interfaces are the highest performing TIMs available.




Detailed Description
(Manufacturer # 2011-X1 )

Metallic Thermal Interface Solution

Supporting Intel Socket 2011-0 & Broadwell-E (6800K, 6850K, 6900K & 6950X) Processors

Indigo Xtreme represents a whole new approach to high-performance cooling of your CPU. Indigo Xtreme is a precision Engineered Thermal Interface (ETI) that keeps CPUs cooler. Much cooler.

The Indigo Xtreme innovative and patented structure deploys a highly conductive Phase Change Metal Alloy (PCMA) into all the surface micro-asperities on your CPU lid and heat sink, resulting in the lowest resistance heat path of any grease, paste, or pad thermal interface product available today.


High Thermal Performance
• Bulk thermal conductivity >20 W/mK
• Lower overall thermal resistance than any grease, paste, or pad TIM (Thermal Interface Material)
• No cure time

High Reliability
• Fully sealed structure - no mess or migration
• Most consistent performance - applies the correct amount of alloy every time
• Gallium-free
• Laser-cut precision

User Friendly
• Fully compatible with copper and aluminum surfaces
• Peel-and-stick application
• Easy clean up - just peel to remove

Proven

As confirmed by independent tests, the Indigo family of engineered thermal interfaces are the highest performing TIMs available.


Specifications
Brand ENERDYNE SOLUTIONS, INC.
Condition New
UPC 865722000000
10000     
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