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Cooler Master High Performance Thermal Paste

Frys#: 9540022 Model: HTK002U1
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Cooler Master thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Detailed Description
(Manufacturer # HTK002U1 )
  • Suitable for CPU, chipsets on Mainboard, VGA card, etc.
  • Easy to use.
  • Zif Socket Templates ensure correct applying area with various CPU socket types.
  • Produces an even layer when using applicator.
  • Dielectric.
  • Wide range of application temperature.
Color: White
Specific Gravity: 2.37
Viscosity/Flowability: Nonflowing
Thermal Conductivity: 0.8 watts/meter- °C
Volume Resistivity: 5.0 x 1015
Dielectric Constant: 4.4 at 100k Hz
Dissipation Factor: 0.02 at 100k Hz
Dielectric Strength: 550 volts/mil; 21.7 kV/mm
Brand Cooler Master
Condition New
UPC 836837001053
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